Spray Photoresist Coating Systems for Semiconductor
Spray Photoresist Coating Systems for Semiconductor
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CSEM-S
CSEM-M
CSEM-L
CSEM-S
Cheersonic is committed to various ultrasonic spraying solutions. Applied to semiconductor photoresist spraying, compared with traditional spin coating and dip coating, ultrasonic have the advantages of high uniformity and controllable coating area. Facts have proved that the photoresist coating prepared by ultrasonic coating has higher microstructure uniformity and uniformity than the traditional spin coating process. Ultrasonic spraying is a significantly efficient and economical photoresist coating process. Cheersonic’s spraying system has the characteristics of precision, flow control, and precise speed control. Due to the extremely low carrier gas volume, the liquid is gentle and non-impact during the spraying process, which greatly avoids the problem of liquid overspray and greatly improves the utilization rate of the liquid.
CSEM-M
Fully automated, programmable standalone system with coordinated XYZ motion control using user-friendly teach pendant with trackball. Versatile mid to high-volume or pilot scale production thin film coatings. Applied to semiconductor photoresist spraying, compared with traditional spin coating and dip coating, ultrasonic have the advantages of high uniformity and controllable coating area. Facts have proved that the photoresist coating prepared by ultrasonic coating has higher microstructure uniformity and uniformity than the traditional spin coating process. Ultrasonic spraying is a significantly efficient and economical photoresist coating process. Cheersonic’s spraying system has the characteristics of precision, flow control, and precise speed control. Cheersonic’s non-blocking ultrasonic coating technology is known for its ultra-thin micron-layer coatings of functional and protective materials. The ultrasonic vibration of the nozzle can effectively disperse the particles in the suspension and produce a very uniform particle dispersion in the film layer, and the conductive particles will not settle out of the suspension.
CSEM-L
Fully-automatic, programmable stand-alone system, using user-friendly teach pendant, can coordinate XYZ motion control. Multifunctional medium, large batch or pilot scale film coating. Equipped with standard conveyor belts for in-line coating solutions. Cheersonic is committed to various ultrasonic spraying solutions. Applied to semiconductor photoresist spraying, compared with traditional spin coating and dip coating, ultrasonic have the advantages of high uniformity and controllable coating area. Facts have proved that the photoresist coating prepared by ultrasonic coating has higher microstructure uniformity and uniformity than the traditional spin coating process. Ultrasonic spraying is a significantly efficient and economical photoresist coating process. Cheersonic’s spraying system has the characteristics of precision, flow control, and precise speed control. Due to the extremely low carrier gas volume, the liquid is gentle and non-impact during the spraying process, which greatly avoids the problem of liquid overspray and greatly improves the utilization rate of the liquid.
Ultrasonic spray of photoresist for MEMS wafers and other substrates with varying topographies
The ultrasonic coating system can use advanced layering technology to precisely control the flow rate, coating speed and deposition amount. Low-speed spray forming defines an atomizing spray as a precise, controllable pattern, avoiding excessive spraying when producing very thin and uniform layers. It turns out that direct spraying using ultrasonic technology is a reliable and effective way to deposit photoresist on 3D microstructures, thereby reducing equipment failures caused by excessive metal exposure to etchant.
Ultrasonic spray systems have proven to be suitable for a variety of applications that require uniform, repeatable photoresist or polyimide film coatings. Cheersonic’s coating system can control thicknesses from sub-micron to more than 100 microns, and can coat any shape or size. It is a feasible alternative to other coating technologies such as spin coating and traditional spray coating.
Cheersonic’s non-blocking ultrasonic coating technology is known for its ultra-thin micron-layer coatings of functional and protective materials. The ultrasonic vibration of the nozzle effectively dispersed the particles in the suspension and produced a very uniform particle dispersion in the film layer, while the conductive particles did not settle out of the suspension.
https://youtu.be/xwMv9yeFJOw
FEATURES & BENEFITS
• Ultrasonic nozzle, particle size is 0-40um
• High uniformity and uniformity
• Non-contact spraying
• Micro-flow spraying, multiple liquid feeding schemes
• High speed control accuracy
• High liquid utilization
