Ultrasonic Spraying Photoresist Coating

Cheersonic’s ultrasonic spraying system has been proven to be suitable for a wide range of applications, including photoresist or polyimide film coating. By controlling thickness from sub-micron to more than 100 microns and being able to apply any shape or size, Cheersonic’s coating system is a substitute for other coating technologies, such as rotation and traditional spraying.

Common applications of photoresist and Polyimide coatings include MEMS, lenses, microfluidic devices, microelectronics and filters. Cheersonic’s coating systems can be coated on flat and 3D substrates, usually including silicon wafers, glass, ceramics and metals.

Ultrasonic spraying is a simple, economical and repeatable coating process for photoresist and polyimide. Cheersonic’s Ultrasonic coating system can use simple layered technology to precisely control the flow rate, coating speed and deposition. Low-speed spray molding defines atomized spray as an accurate, controllable pattern that avoids over-spraying while generating a very thin uniform layer.

Advantages of Ultrasonic nozzle photoresist and polyimide include:

Uniform film coverage of various surface parts.
High flexibility.
No blockage atomization spray.
Transfer efficiency is high and waste is extremely low.
A highly repeatable, mature spraying process.